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测试半导体(ti)器件(jian)性能(neng)方法高(gao)低温拉(la)力试验机：

目(mu)的(de)：

用(yong)(yong)于(yu)测(ce)(ce)(ce)(ce)(ce)试(shi)半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)器(qi)(qi)件(jian)在(zai)(zai)不(bu)同(tong)(tong)温(wen)(wen)(wen)(wen)度(du)(du)下(xia)(xia)性(xing)(xing)(xing)(xing)(xing)能(neng)(neng)的(de)(de)(de)设备。它可(ke)以(yi)模拟各(ge)种(zhong)环境(jing)温(wen)(wen)(wen)(wen)度(du)(du)，从而(er)对(dui)半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)器(qi)(qi)件(jian)的(de)(de)(de)性(xing)(xing)(xing)(xing)(xing)能(neng)(neng)进行(xing)(xing)(xing)(xing)全(quan)面的(de)(de)(de)测(ce)(ce)(ce)(ce)(ce)试(shi)和(he)(he)评(ping)估。用(yong)(yong)于(yu)测(ce)(ce)(ce)(ce)(ce)试(shi)半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)器(qi)(qi)件(jian)的(de)(de)(de)温(wen)(wen)(wen)(wen)度(du)(du)特性(xing)(xing)(xing)(xing)(xing)。在(zai)(zai)不(bu)同(tong)(tong)的(de)(de)(de)温(wen)(wen)(wen)(wen)度(du)(du)下(xia)(xia)，半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)器(qi)(qi)件(jian)的(de)(de)(de)电性(xing)(xing)(xing)(xing)(xing)能(neng)(neng)会发生(sheng)变(bian)化(hua)，因此需要对(dui)其进行(xing)(xing)(xing)(xing)测(ce)(ce)(ce)(ce)(ce)试(shi)。通过半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)高(gao)低(di)温(wen)(wen)(wen)(wen)测(ce)(ce)(ce)(ce)(ce)试(shi)机，可(ke)以(yi)模拟各(ge)种(zhong)温(wen)(wen)(wen)(wen)度(du)(du)环境(jing)，从而(er)对(dui)半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)器(qi)(qi)件(jian)的(de)(de)(de)温(wen)(wen)(wen)(wen)度(du)(du)特性(xing)(xing)(xing)(xing)(xing)进行(xing)(xing)(xing)(xing)测(ce)(ce)(ce)(ce)(ce)试(shi)和(he)(he)评(ping)估。半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)高(gao)低(di)温(wen)(wen)(wen)(wen)测(ce)(ce)(ce)(ce)(ce)试(shi)机还(hai)可(ke)以(yi)用(yong)(yong)于(yu)测(ce)(ce)(ce)(ce)(ce)试(shi)半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)器(qi)(qi)件(jian)的(de)(de)(de)可(ke)靠(kao)性(xing)(xing)(xing)(xing)(xing)。在(zai)(zai)不(bu)同(tong)(tong)的(de)(de)(de)温(wen)(wen)(wen)(wen)度(du)(du)下(xia)(xia)，半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)器(qi)(qi)件(jian)的(de)(de)(de)可(ke)靠(kao)性(xing)(xing)(xing)(xing)(xing)也(ye)会发生(sheng)变(bian)化(hua)。通过半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)高(gao)低(di)温(wen)(wen)(wen)(wen)测(ce)(ce)(ce)(ce)(ce)试(shi)机，可(ke)以(yi)模拟各(ge)种(zhong)温(wen)(wen)(wen)(wen)度(du)(du)环境(jing)，从而(er)对(dui)半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)器(qi)(qi)件(jian)的(de)(de)(de)可(ke)靠(kao)性(xing)(xing)(xing)(xing)(xing)进行(xing)(xing)(xing)(xing)测(ce)(ce)(ce)(ce)(ce)试(shi)和(he)(he)评(ping)估。半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)高(gao)低(di)温(wen)(wen)(wen)(wen)测(ce)(ce)(ce)(ce)(ce)试(shi)机还(hai)可(ke)以(yi)用(yong)(yong)于(yu)测(ce)(ce)(ce)(ce)(ce)试(shi)半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)器(qi)(qi)件(jian)的(de)(de)(de)性(xing)(xing)(xing)(xing)(xing)能(neng)(neng)稳(wen)(wen)定(ding)性(xing)(xing)(xing)(xing)(xing)。在(zai)(zai)不(bu)同(tong)(tong)的(de)(de)(de)温(wen)(wen)(wen)(wen)度(du)(du)下(xia)(xia)，半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)器(qi)(qi)件(jian)的(de)(de)(de)性(xing)(xing)(xing)(xing)(xing)能(neng)(neng)稳(wen)(wen)定(ding)性(xing)(xing)(xing)(xing)(xing)也(ye)会发生(sheng)变(bian)化(hua)。通过半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)高(gao)低(di)温(wen)(wen)(wen)(wen)测(ce)(ce)(ce)(ce)(ce)试(shi)机，可(ke)以(yi)模拟各(ge)种(zhong)温(wen)(wen)(wen)(wen)度(du)(du)环境(jing)，从而(er)对(dui)半(ban)(ban)(ban)导(dao)(dao)(dao)(dao)体(ti)(ti)器(qi)(qi)件(jian)的(de)(de)(de)性(xing)(xing)(xing)(xing)(xing)能(neng)(neng)稳(wen)(wen)定(ding)性(xing)(xing)(xing)(xing)(xing)进行(xing)(xing)(xing)(xing)测(ce)(ce)(ce)(ce)(ce)试(shi)和(he)(he)评(ping)估。

试样制备：

首先(xian)需要将待测试的芯片、集成电路等半导体器(qi)件获取到样(yang)品，并在其表面(mian)镀上(shang)金属，以(yi)便与(yu)测试机上(shang)的针脚连(lian)接(jie)。

设备(bei)连接。将测试机上(shang)的针(zhen)脚(jiao)和器件相连接，使(shi)测试机能够(gou)获(huo)取(qu)并控制(zhi)芯片(pian)上(shang)的信号和电流(liu)。

温度(du)设定。在(zai)连接完成(cheng)后(hou)，将设备进入(ru)恒温状态，并将其(qi)温度(du)设定为高低温范围内。

测(ce)试信(xin)号(hao)发送(song)。当设备已经到(dao)达设定的温度后(hou)，将测(ce)试信(xin)号(hao)发送(song)至芯片(pian)上，以获取该器件的性能数据。

性(xing)能参(can)数分(fen)析。通(tong)过将性(xing)能参(can)数与测(ce)试机的预定(ding)义值进行比较(jiao)，可以确(que)定(ding)芯(xin)(xin)片的性(xing)能情况。如果(guo)芯(xin)(xin)片的性(xing)能参(can)数不符合预期(qi)的值，则需(xu)要对芯(xin)(xin)片进行修(xiu)复或更换。

测试(shi)方法：

可提(ti)供-85～250 度的(de)测(ce)(ce)试环境温度，设备不直接(jie)作用于测(ce)(ce)试物件，而是(shi)连接(jie)到一个测(ce)(ce)试平台(tai)适配器上，部件内部通过(guo)导热(re)介质进行加热(re)和冷却测(ce)(ce)试，控制温度精度保持(chi)在±0.3℃。

半(ban)导体电源芯片高低温(wen)测试均可(ke)以(yi)和电脑连接(jie)，通过组态软件实现电脑画面与仪器设(she)备画面同步(bu)，通信距离 200 米以(yi)内均(jun)可(ke)轻(qing)松(song)实(shi)现温度设(she)定，实(shi)时控制画面(mian)。7 寸彩色大(da)屏幕(mu)，温度曲线记录，程序(xu)选择(ze)及(ji)报警画面(mian)记录等(deng)。实(shi)现可(ke)视(shi)化、数据(ju)储存和汇报分析。